In the complex system of power batteries, busbars (PACK components) serve as the "energy link" between cells, where their precision and reliability directly determine the performance and safety of the battery pack. We specialize in providing integrated busbar solutions with high conductivity, low impedance, and superior consistency, ensuring efficient energy convergence for each cell with micrometer-level precision.

1. Micrometer-Level Precision Manufacturing 

High-precision stamping process with dimensional tolerance of ±0.03mm

Automated visual inspection with 100% dimensional control

2. Superior Electrical Performance 

Ultra-low contact resistance design (≤0.05mΩ @50A)

Optimized current density distribution with uniformity ≥95%

High-frequency low-loss design (compatible with SiC applications)

3. Advanced Material Science 

High-conductivity pure copper series (C1100/C10100, conductivity ≥100% IACS)

High-performance aluminum alloy (lightweight + low cost)

Aluminum-copper composite busbars (lightweight + high conductivity)

4. End-to-End Consistency 

Automated production line with CPK ≥1.67

Full batch material traceability with performance consistency ≥99.9%

Reel-to-reel packaging compatible with high-speed automated assembly

5. Surface Treatment Technologies 

Selective Plating Options:

Local nickel plating (thickness: 2–10μm)

Local tin plating (thickness: 3–15μm)

Local powder immersion (thickness: 40–80μm)

In the complex system of power batteries, busbars (PACK components) serve as the "energy link" between cells, where their precision and reliability directly determine the performance and safety of the battery pack. We specialize in providing integrated busbar solutions with high conductivity, low impedance, and superior consistency, ensuring efficient energy convergence for each cell with micrometer-level precision.

1. Micrometer-Level Precision Manufacturing 

High-precision stamping process with dimensional tolerance of ±0.03mm

Automated visual inspection with 100% dimensional control

2. Superior Electrical Performance 

Ultra-low contact resistance design (≤0.05mΩ @50A)

Optimized current density distribution with uniformity ≥95%

High-frequency low-loss design (compatible with SiC applications)

3. Advanced Material Science 

High-conductivity pure copper series (C1100/C10100, conductivity ≥100% IACS)

High-performance aluminum alloy (lightweight + low cost)

Aluminum-copper composite busbars (lightweight + high conductivity)

4. End-to-End Consistency 

Automated production line with CPK ≥1.67

Full batch material traceability with performance consistency ≥99.9%

Reel-to-reel packaging compatible with high-speed automated assembly

5. Surface Treatment Technologies 

Selective Plating Options:

Local nickel plating (thickness: 2–10μm)

Local tin plating (thickness: 3–15μm)

Local powder immersion (thickness: 40–80μm)